发明授权
- 专利标题： Sealing structure
- 专利标题（中）： 密封结构
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申请号： US12602925申请日： 2008-03-07
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公开(公告)号： US08178794B2公开(公告)日： 2012-05-15
- 发明人: Takahiro Hayashi , Makoto Hora , Keiichi Miyajima
- 申请人： Takahiro Hayashi , Makoto Hora , Keiichi Miyajima
- 申请人地址： JP
- 专利权人： NOK Corporation
- 当前专利权人： NOK Corporation
- 当前专利权人地址： JP
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： JP2007-248843 20070926
- 国际申请： PCT/JP2008/054700 WO 20080307
- 国际公布： WO2009/041087 WO 20090402
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H05K5/06
摘要：
To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.
公开/授权文献
- US20100212953A1 SEALING STRUCTURE 公开/授权日：2010-08-26
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