发明授权
- 专利标题: Compound semiconductor substrate and control for electrical property thereof
- 专利标题(中): 复合半导体基板及其电性能的控制
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申请号: US12442156申请日: 2007-11-15
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公开(公告)号: US08178951B2公开(公告)日: 2012-05-15
- 发明人: Young Zo Yoo , Hyun Min Shin , Jun Sung Choi
- 申请人: Young Zo Yoo , Hyun Min Shin , Jun Sung Choi
- 申请人地址: KR Gyeongsangbuk-do
- 专利权人: Samsung Corning Precision Materials Co., Ltd.
- 当前专利权人: Samsung Corning Precision Materials Co., Ltd.
- 当前专利权人地址: KR Gyeongsangbuk-do
- 代理机构: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 优先权: KR10-2006-0115115 20061121; KR10-2007-0115882 20071114
- 国际申请: PCT/KR2007/005730 WO 20071115
- 国际公布: WO2008/062968 WO 20080529
- 主分类号: H01L23/58
- IPC分类号: H01L23/58 ; H01L29/20
摘要:
There is provided a compound semiconductor substrate prepared by forming a point defect in an inside structure thereof by implanting an electrically-neutral impurity with energy of 0.1 to 10 MeV on a surface of the substrate. When the compound semiconductor is undoped, electrical resistance increases to increase insulating properties, and when the compound semiconductor is doped with an n-type dopant, the impurity is implanted and charge concentration of the substrate increases to increase conductive properties. In accordance with the present invention, the various electrical properties needed for the compound semiconductor can be effectively controlled by increasing the insulating properties of the undoped compound semiconductor or by increasing the charge concentration of the n-type compound semiconductor, and the application range to various devices can be expanded.
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