发明授权
- 专利标题： Microstrip structure including a signal line with a plurality of slit holes
- 专利标题（中）： 微带结构包括具有多个狭缝孔的信号线
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申请号： US12356589申请日： 2009-01-21
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公开(公告)号： US08178974B2公开(公告)日： 2012-05-15
- 发明人: Masayuki Mizuno
- 申请人： Masayuki Mizuno
- 申请人地址： JP Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP11-266203 19990920
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
A semiconductor device comprising a signal transmission line of a microstrip structure, capable of increasing the characteristic impedance of the signal transmission line and reducing coupling between a plurality of signal lines. In a signal transmission line of a microstrip structure composed of a signal line and a ground plate, the capacitance between wires is reduced and the characteristic impedance can be increased by forming holes in the signal line or in the ground plate. The coupling between a plurality of signal lines can also be reduced.
公开/授权文献
- US20090134524A1 SEMICONDUCTOR INTEGRATED CIRCUIT 公开/授权日：2009-05-28
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