Invention Grant
- Patent Title: Semiconductor die package and method for making the same
- Patent Title (中): 半导体管芯封装及其制造方法
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Application No.: US12823411Application Date: 2010-06-25
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Publication No.: US08183088B2Publication Date: 2012-05-22
- Inventor: Oseob Jeon , Yoonhwa Choi , Boon Huan Gooi , Maria Cristina B. Estacio , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Byoung-Ok Lee
- Applicant: Oseob Jeon , Yoonhwa Choi , Boon Huan Gooi , Maria Cristina B. Estacio , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Byoung-Ok Lee
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
Public/Granted literature
- US20100258925A1 SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME Public/Granted day:2010-10-14
Information query
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