发明授权
- 专利标题： Integrated circuits having interconnects and heat dissipators based on nanostructures
- 专利标题（中）： 具有基于纳米结构的互连和散热器的集成电路
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申请号： US12830135申请日： 2010-07-02
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公开(公告)号： US08183659B2公开(公告)日： 2012-05-22
- 发明人: Mohammad Shafiqul Kabir
- 申请人： Mohammad Shafiqul Kabir
- 专利权人： Smoltek AB
- 当前专利权人： Smoltek AB
- 代理机构： Fish & Richardson P.C.
- 优先权： SE0501888 20050826
- 主分类号： H01L27/095
- IPC分类号： H01L27/095
摘要：
The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices.
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