发明授权
US08183661B2 Semiconductor die with event detection for reduced power consumption 有权
半导体芯片具有事件检测功能,可降低功耗

  • 专利标题: Semiconductor die with event detection for reduced power consumption
  • 专利标题(中): 半导体芯片具有事件检测功能,可降低功耗
  • 申请号: US13092078
    申请日: 2011-04-21
  • 公开(公告)号: US08183661B2
    公开(公告)日: 2012-05-22
  • 发明人: Wenkwei Lou
  • 申请人: Wenkwei Lou
  • 申请人地址: US CA Irvine
  • 专利权人: Broadcom Corporation
  • 当前专利权人: Broadcom Corporation
  • 当前专利权人地址: US CA Irvine
  • 代理机构: Farjami & Farjami LLP
  • 主分类号: H01L29/00
  • IPC分类号: H01L29/00
Semiconductor die with event detection for reduced power consumption
摘要:
According to one exemplary embodiment, a power managing semiconductor die with reduced power consumption includes a power island including an event detection block and an event qualification block. The event detection block is configured to activate the event qualification block in response to an input signal initiated by an external event. The input signal is coupled to the event detection block, for example, via a bond pad situated in an I/O region of the power managing semiconductor die. The event qualification block is configured to determine if the external event is a valid external event. The event qualification block resides in a thin oxide region and the event detection block resides in a thick oxide region of the semiconductor die. The power managing semiconductor die further includes a power management unit configured to activate the event qualification block in response to power enable signal outputted by the event detection block.
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