发明授权
- 专利标题: Semiconductor device and method of manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US12292386申请日: 2008-11-18
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公开(公告)号: US08183695B2公开(公告)日: 2012-05-22
- 发明人: Toru Yamazaki
- 申请人: Toru Yamazaki
- 申请人地址: JP Kawasaki-shi, Kanagawa
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Kawasaki-shi, Kanagawa
- 代理机构: McGinn IP Law Group, PLLC
- 优先权: JP2007-305012 20071126
- 主分类号: H01L29/40
- IPC分类号: H01L29/40
摘要:
A semiconductor chip includes a semiconductor chip region provided with a plurality of internal circuits, and a plurality of electrode pads provided proximate to an outer edge of the semiconductor chip region and each electrically connected to any one of the plurality of internal circuits. The plurality of electrode pads include: a long pad including a probe region with which a probe is brought into contact, and a bonding region provided in a position different from a position of the probe region, for bonding a wire; and a short pad for high frequency, which is formed to have a smaller pad area compared with the long pad and inputs/outputs a high frequency signal by employing a structure including the bonding region but the probe region.