Invention Grant
- Patent Title: Low pin interface testing module
- Patent Title (中): 低引脚接口测试模块
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Application No.: US12344060Application Date: 2008-12-24
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Publication No.: US08185338B2Publication Date: 2012-05-22
- Inventor: Rahul Hakoo , Chilakala Ravi Kumar , Deepak Baranwal
- Applicant: Rahul Hakoo , Chilakala Ravi Kumar , Deepak Baranwal
- Applicant Address: NL Amsterdam
- Assignee: STMicroelectronics International N.V.
- Current Assignee: STMicroelectronics International N.V.
- Current Assignee Address: NL Amsterdam
- Agency: Gardere Wynne Sewell LLP
- Priority: IN2699/DEL/2007 20071224
- Main IPC: G01R31/27
- IPC: G01R31/27 ; G01R31/02 ; G01R31/316 ; G01R31/317

Abstract:
A low pin interface module is provided for testing an integrated circuit. The interface module includes an input-output module, a controlling module, a processing module and a storage module specific to the integrated circuit to be tested. The interface module reduces the required number of hardware pins in the integrated circuit for a standalone testing without limiting the integrated circuit testing features. A methodology and a control mechanism achieved with the interface module can be used for the standalone testing of any integrated circuit without using a Joint European Test Action Group test logic interface JTAG implemented following the IEEE Standard 1149.1-1990. The interface module is not limited by a particular debugging platform and allows access to all test features in the integrated circuit with a reduced number of hardware pins and thereby leading to enhanced testing speeds on a tester in parallel and a shorter time-to-a market cycle and a lower development cost.
Public/Granted literature
- US20090228231A1 LOW PIN INTERFACE TESTING MODULE Public/Granted day:2009-09-10
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