Invention Grant
- Patent Title: Porous cured epoxy resin
- Patent Title (中): 多孔固化环氧树脂
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Application No.: US11794698Application Date: 2006-01-06
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Publication No.: US08186519B2Publication Date: 2012-05-29
- Inventor: Norio Tsujioka , Satoshi Aoki , Ken Hosoya
- Applicant: Norio Tsujioka , Satoshi Aoki , Ken Hosoya
- Applicant Address: JP Kyoto-Shi
- Assignee: Emaus Kyoto, Inc.
- Current Assignee: Emaus Kyoto, Inc.
- Current Assignee Address: JP Kyoto-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2005-002550 20050107
- International Application: PCT/JP2006/300069 WO 20060106
- International Announcement: WO2006/079760 WO 20060803
- Main IPC: B01D71/46
- IPC: B01D71/46 ; B01D15/08 ; B01D15/00 ; B01D61/00

Abstract:
A porous object comprising a three-dimensional network skeleton of a cured epoxy resin and having interconnecting pores, characterized in that the three-dimensional network skeleton forms a non-particle-aggregation type porous object constituted of a three-dimensional branched columnar structure, the proportion of aromatic-ring-derived carbon atoms to all the carbon atoms as a component of the cured epoxy resin is 0.10-0.65, and the porous object has a porosity of 20-80% and an average pore diameter of 0.5-50 μm.
Public/Granted literature
- US20080210626A1 Porous Cured Epoxy Resin Public/Granted day:2008-09-04
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