Invention Grant
- Patent Title: Copper nanoparticle dispersion
- Patent Title (中): 铜纳米颗粒分散体
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Application No.: US12405789Application Date: 2009-03-17
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Publication No.: US08187504B2Publication Date: 2012-05-29
- Inventor: Young Il Lee , Dong Hoon Kim , Kwi Jong Lee
- Applicant: Young Il Lee , Dong Hoon Kim , Kwi Jong Lee
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0076447 20080805
- Main IPC: H01B1/22
- IPC: H01B1/22
Abstract:
Provided is a metal nanoparticle dispersion capable of suppressing spreadability at a room temperature and drying phenomenon at heating temperature. The metal nanoparticle dispersion includes metal particles; and an organic solvent having a viscosity of 10 mPa·s or more at a room temperature and a flash point of 100° C. or above.
Public/Granted literature
- US20100032615A1 METAL NANOPARTICLE DISPERSION Public/Granted day:2010-02-11
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