发明授权
- 专利标题： Wirebond pad for semiconductor chip or wafer
- 专利标题（中）： 用于半导体芯片或晶圆的焊盘
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申请号： US11756621申请日： 2007-05-31
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公开(公告)号： US08187965B2公开(公告)日： 2012-05-29
- 发明人: Mou-Shiung Lin , Michael Chen , Chien-Kang Chou , Mark Chou
- 申请人： Mou-Shiung Lin , Michael Chen , Chien-Kang Chou , Mark Chou
- 申请人地址： TW Hsinchu
- 专利权人： Megica Corporation
- 当前专利权人： Megica Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： McDermott Will & Emery LLP
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
公开/授权文献
- US20090053887A1 WIREBOND PAD FOR SEMICONDUCTOR CHIP OR WAFER 公开/授权日：2009-02-26
信息查询
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