Invention Grant
- Patent Title: Integration of vacuum microelectronic device with integrated circuit
- Patent Title (中): 真空微电子器件与集成电路的集成
-
Application No.: US11418318Application Date: 2006-05-05
-
Publication No.: US08188431B2Publication Date: 2012-05-29
- Inventor: Jonathan Gorrell
- Applicant: Jonathan Gorrell
- Agency: Davidson, Berquist, Jackson & Gowdey LLP
- Main IPC: H01J1/00
- IPC: H01J1/00 ; G01T1/00
Abstract:
A device includes an integrated circuit (IC) and at least one ultra-small resonant structure formed on said IC. At least the ultra-small resonant structure portion of the device is vacuum packaged. The ultra-small resonant structure portion of the device may be grounded or connected to a known electrical potential. The ultra-small resonant structure may be electrically connected to the underlying IC, or not.
Public/Granted literature
- US20070259465A1 Integration of vacuum microelectronic device with integrated circuit Public/Granted day:2007-11-08
Information query
