Invention Grant
- Patent Title: Layout structure for chip coupling
- Patent Title (中): 芯片耦合布局结构
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Application No.: US11941631Application Date: 2007-11-16
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Publication No.: US08188607B2Publication Date: 2012-05-29
- Inventor: Shao-Ping Lin , Shuo-Yen Hung
- Applicant: Shao-Ping Lin , Shuo-Yen Hung
- Applicant Address: TW Hsinchu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP
- Priority: TW96112142A 20070404
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A layout structure disposed on the substrate of the liquid crystal display (LCD) for chip coupling is provided. The first and second orientations that are substantially perpendicular to the first orientation can be defined on the substrate. The layout structure includes a plurality of lines, which extend along the second orientation, and a plurality of conductive pads that are respectively disposed on the lines. The conductive pads are distributed along the first orientation and staggered along the second orientation. Each line can shift away from the adjacent conductive pad on the first orientation. Thus, the LCD chip has a better conductivity and a thinner dimension under the precision of the conventional machines.
Public/Granted literature
- US20080246167A1 Layout Structure for Chip Coupling Public/Granted day:2008-10-09
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