Invention Grant
- Patent Title: Method for laying floor panels
- Patent Title (中): 铺设地板的方法
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Application No.: US12865625Application Date: 2009-06-24
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Publication No.: US08191334B2Publication Date: 2012-06-05
- Inventor: Roger Braun
- Applicant: Roger Braun
- Applicant Address: MT Pieta
- Assignee: Flooring Technologies Ltd.
- Current Assignee: Flooring Technologies Ltd.
- Current Assignee Address: MT Pieta
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Andrew M. Calderon
- Priority: DE102008031167 20080703
- International Application: PCT/EP2009/004550 WO 20090624
- International Announcement: WO2010/006684 WO 20100121
- Main IPC: E04B2/00
- IPC: E04B2/00

Abstract:
A method for laying floor panels in a room to form a closed floor area on a laying plane (R) without using an adhesive. The floor panels especially comprising a wood material, such as MDF or HDF, and having matching corresponding profiles on opposite longitudinal edges (I, I′) and transverse edges (II, II′). The closed floor area is obtained by interconnecting a plurality of panels on their transverse edges (II, II′) to give a row (R1) and on their longitudinal edges (I,I′) to give a plurality of rows (Rn) and then locking them in relation to each other.
Public/Granted literature
- US20110016822A1 METHOD FOR LAYING FLOOR PANELS Public/Granted day:2011-01-27
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