Invention Grant
- Patent Title: SMD diode holding structure and package thereof
- Patent Title (中): SMD二极管保持结构及封装
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Application No.: US12588415Application Date: 2009-10-15
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Publication No.: US08193540B2Publication Date: 2012-06-05
- Inventor: Yi-Ming Huang , Hsiang-Cheng Hsieh
- Applicant: Yi-Ming Huang , Hsiang-Cheng Hsieh
- Applicant Address: TW Hsinchu
- Assignee: Lextar Electronics Corp.
- Current Assignee: Lextar Electronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Rosenberg, Klein & Lee
- Priority: TW95139336A 20061025
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
An SMD diode holding structure includes a plastic housing and a plurality of metal holders. Two ends of the plastic housing from a function area and a notch. The metal holder has a base portion and a connecting pin portion. The top and bottom surfaces of the base portion are exposed to the function area and the notch. The top surface of one base portion in the function area is connected with an LED chip, and the bottom surface of another base portion in the notch is connected with the anti-ESD chip. The LED chip, the anti-ESD chip, and the base portion are connected with a conductive wire. The function area is covered with a first sealing compound, and the notch is covered with a second sealing compound. Light emitted from the LED chip is uniformly reflected in the function area, and the brightness is uniform.
Public/Granted literature
- US20100032709A1 SMD diode holding structure and package thereof Public/Granted day:2010-02-11
Information query
IPC分类: