发明授权
- 专利标题： Micro-electro-mechanical systems (MEMS) package
- 专利标题（中）： 微机电系统（MEMS）封装
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申请号： US12203151申请日： 2008-09-03
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公开(公告)号： US08193596B2公开(公告)日： 2012-06-05
- 发明人: Chien-Hsing Lee , Tsung-Min Hsieh , Chih-Hsiang Lin
- 申请人： Chien-Hsing Lee , Tsung-Min Hsieh , Chih-Hsiang Lin
- 申请人地址： TW Hsinchu
- 专利权人： Solid State System Co., Ltd.
- 当前专利权人： Solid State System Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Jianq Chyun IP Office
- 主分类号： H01L29/84
- IPC分类号： H01L29/84
摘要：
A micro-electro-mechanical systems (MEMS) package includes a MEMS microphone device. The MEMS microphone device has a first substrate and at least a sensing element on the first substrate wherein a first chamber in the MEMS microphone device is connected to the sensing element. A second substrate is disposed over the MEMS microphone device to provide a second chamber in the second substrate over the sensing element opposite to the first chamber.
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