Invention Grant
- Patent Title: Micro-electro-mechanical systems (MEMS) package
- Patent Title (中): 微机电系统（MEMS）封装
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Application No.: US12203151Application Date: 2008-09-03
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Publication No.: US08193596B2Publication Date: 2012-06-05
- Inventor: Chien-Hsing Lee , Tsung-Min Hsieh , Chih-Hsiang Lin
- Applicant: Chien-Hsing Lee , Tsung-Min Hsieh , Chih-Hsiang Lin
- Applicant Address: TW Hsinchu
- Assignee: Solid State System Co., Ltd.
- Current Assignee: Solid State System Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
A micro-electro-mechanical systems (MEMS) package includes a MEMS microphone device. The MEMS microphone device has a first substrate and at least a sensing element on the first substrate wherein a first chamber in the MEMS microphone device is connected to the sensing element. A second substrate is disposed over the MEMS microphone device to provide a second chamber in the second substrate over the sensing element opposite to the first chamber.
Public/Granted literature
- US20100052082A1 MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) PACKAGE AND METHOD FOR FORMING THE MEMS PACKAGE Public/Granted day:2010-03-04
Information query
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