发明授权
- 专利标题： Mounted semiconductor device and a method for making the same
- 专利标题（中）： 安装半导体器件及其制造方法
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申请号： US12880025申请日： 2010-09-10
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公开(公告)号： US08193634B2公开(公告)日： 2012-06-05
- 发明人: Andre Wong , Sukbhir Bajwa
- 申请人： Andre Wong , Sukbhir Bajwa
- 代理机构： Pequignot + Myers LLC
- 代理商 Matthew A. Pequignot
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.
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