发明授权
- 专利标题: MEMS and a protection structure thereof
- 专利标题(中): MEMS及其保护结构
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申请号: US12538168申请日: 2009-08-10
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公开(公告)号: US08193640B2公开(公告)日: 2012-06-05
- 发明人: Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
- 申请人: Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
- 申请人地址: TW Hsin-Chu
- 专利权人: United Microelectronics Corp.
- 当前专利权人: United Microelectronics Corp.
- 当前专利权人地址: TW Hsin-Chu
- 代理商 Winston Hsu; Scott Margo
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
A protection structure of a pad is provided. The pad is disposed in a dielectric layer on a semiconductor substrate and the pad includes a connection region and a peripheral region which encompasses the connection region. The protection structure includes at least a barrier, an insulation layer and a mask layer. The barrier is disposed in the dielectric layer in the peripheral region. The insulation layer is disposed on the dielectric layer. The mask layer is disposed on the dielectric layer and covers the insulation layer and the mask layer includes an opening to expose the connection region of the pad.
公开/授权文献
- US20110031624A1 MEMS and a Protection Structure Thereof 公开/授权日:2011-02-10