Invention Grant
US08194355B1 Head stack assembly with a laminated flexure having a snap-through feature
有权
具有具有快插特征的层压挠曲件的头部堆叠组件
- Patent Title: Head stack assembly with a laminated flexure having a snap-through feature
- Patent Title (中): 具有具有快插特征的层压挠曲件的头部堆叠组件
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Application No.: US12117049Application Date: 2008-05-08
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Publication No.: US08194355B1Publication Date: 2012-06-05
- Inventor: Tzong-Shii Pan , Ali Hosseinzadeh
- Applicant: Tzong-Shii Pan , Ali Hosseinzadeh
- Applicant Address: US CA Irvine
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA Irvine
- Main IPC: G11B5/55
- IPC: G11B5/55

Abstract:
A novel head stack assembly (HSA) includes a flex cable with a first side and an opposing second side, and having a hole therethrough. The HSA also includes a head gimbal assembly (HGA) having a load beam, a laminated flexure attached to the load beam, and a head attached to the laminated flexure. The laminated flexure includes a flexure tail with a snap-through feature. The snap-through feature has a plurality of windows in the flexure tail, a snap-through feature central portion that is centric to the plurality of windows, and a plurality of lobes. Each lobe extends out from the snap-through feature central portion radially into one of the plurality of windows. The laminated flexure overlies and contacts the flex cable on its first side, but the snap-through feature is disposed through the hole so that each of the plurality of lobes contacts the flex cable on its second side.
Information query
IPC分类: