A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four recesses, formed therein. A threaded aperture is also formed in the backer plate. A compression plate is also provided. A second set of apertures is formed along the periphery of the compression plate. The lower surface of the compression plate has at least one compression plate recess, and at least one compression plate aperture. At least one compression spring is disposed between the backer plate and the compression plate. A screw tension release mechanism is screwed into the backer plate threaded aperture and inserted through the compression plate aperture. When the release mechanism is loosened, backer plate is forced downwardly, applying a uniform force to all electrical contacts on the printed circuit board or card to which the clamping mechanism is attached.