发明授权
- 专利标题： Electronic component mounting module and electrical apparatus
- 专利标题（中）： 电子元件安装模块和电气设备
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申请号： US12625917申请日： 2009-11-25
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公开(公告)号： US08197099B2公开(公告)日： 2012-06-12
- 发明人: Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Naoko Matsui
- 申请人： Tsuyoshi Oyaizu , Seiko Kawashima , Haruki Takei , Naoko Matsui
- 申请人地址： JP Kanagawa
- 专利权人： Toshiba Lighting & Technology Corporation
- 当前专利权人： Toshiba Lighting & Technology Corporation
- 当前专利权人地址： JP Kanagawa
- 代理机构： DLA Piper LLP (US)
- 优先权： JP2008-303670 20081128; JP2009-252591 20091104
- 主分类号： F21V29/00
- IPC分类号： F21V29/00
摘要：
The invention provides an electronic component mounting module capable of increasing the adhesion between the board and the heat radiating member, improving the thermal conductivity, and effectively radiating heat generated from the LEDs being an electronic component. The LEDs are mounted on the surface of the ceramics board, and the rear surface 1b side of the board is disposed at the heat radiating member. A metallic fine particle layer having high thermal conductivity and flexibility is made to intervene between the board and the heat radiating member.