发明授权
- 专利标题： Manufacturing method of printed circuit board
- 专利标题（中）： 印刷电路板的制造方法
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申请号： US12508224申请日： 2009-07-23
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公开(公告)号： US08197702B2公开(公告)日： 2012-06-12
- 发明人: Myung-Sam Kang , Jung-Hyun Park , Ji-Eun Kim
- 申请人： Myung-Sam Kang , Jung-Hyun Park , Ji-Eun Kim
- 申请人地址： KR Gyunggi-do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Gyunggi-do
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2008-0120966 20081202
- 主分类号： C25D5/02
- IPC分类号： C25D5/02 ; B32B37/00 ; B32B38/00
摘要：
Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on one side of a carrier, pressing one side of the carrier into one side of the insulator, removing the carrier, forming a hole penetrating through the insulator by processing one end of the circuit pattern, and forming a conductive material inside the hole to have the conductive material correspond to the via.
公开/授权文献
- US20100132876A1 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD 公开/授权日：2010-06-03
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