发明授权
- 专利标题： Fabrication method for thermoelectric device
- 专利标题（中）： 热电元件制造方法
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申请号： US12644712申请日： 2009-12-22
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公开(公告)号： US08198116B2公开(公告)日： 2012-06-12
- 发明人: Lidong Chen , Monika Backhaus-Ricoult , Lin He , Xiaoya Li , Xugui Xia , Degang Zhao
- 申请人： Lidong Chen , Monika Backhaus-Ricoult , Lin He , Xiaoya Li , Xugui Xia , Degang Zhao
- 申请人地址： US NY Corning CN Shanghai
- 专利权人： Corning Incorporated,Shanghai Institute of Ceramics
- 当前专利权人： Corning Incorporated,Shanghai Institute of Ceramics
- 当前专利权人地址： US NY Corning CN Shanghai
- 代理商 Michael W. Russell
- 优先权： CN200810207957 20081226
- 主分类号： H01L21/04
- IPC分类号： H01L21/04
摘要：
A method for fabricating thermoelectric device is provided. The method comprises placing a first electrode in a die, forming a first interlayer on an upper surface of the first electrode; positioning a separating plate on an upper surface of the first interlayer to divide an inner space of the die into a plurality of cells, and depositing a first thermoelectric material on the first interlayer within a first fraction of the cells, and depositing a second thermoelectric material on the first interlayer within a second fraction of the cells, sintering the die contents, and removing the separating plate after sintering to obtain a π shaped thermoelectric device.
公开/授权文献
- US20100167444A1 FABRICATION METHOD FOR THERMOELECTRIC DEVICE 公开/授权日：2010-07-01
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