Invention Grant
- Patent Title: Flexible printed circuit board and method of manufacturing the same
- Patent Title (中): 柔性印刷电路板及其制造方法
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Application No.: US12213570Application Date: 2008-06-20
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Publication No.: US08198542B2Publication Date: 2012-06-12
- Inventor: Kyung Ho Lee , Se Min Oh , Chang Hwan Choi , Choon Keun Lee , Jeong Yeol Moon , Jong Rip Kim
- Applicant: Kyung Ho Lee , Se Min Oh , Chang Hwan Choi , Choon Keun Lee , Jeong Yeol Moon , Jong Rip Kim
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0133299 20071218
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.
Public/Granted literature
- US20090151988A1 Flexible printed circuit board and method of manufacturing the same Public/Granted day:2009-06-18
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