发明授权
- 专利标题: Semiconductor memory device and method for manufacturing same
- 专利标题(中): 半导体存储器件及其制造方法
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申请号: US12808321申请日: 2008-12-25
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公开(公告)号: US08198667B2公开(公告)日: 2012-06-12
- 发明人: Takuji Kuniya , Yosuke Komori , Ryota Katsumata , Yoshiaki Fukuzumi , Masaru Kito , Masaru Kidoh , Hiroyasu Tanaka , Megumi Ishiduki , Hideaki Aochi
- 申请人: Takuji Kuniya , Yosuke Komori , Ryota Katsumata , Yoshiaki Fukuzumi , Masaru Kito , Masaru Kidoh , Hiroyasu Tanaka , Megumi Ishiduki , Hideaki Aochi
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2007-336612 20071227; JP2008-177988 20080708
- 国际申请: PCT/JP2008/003968 WO 20081225
- 国际公布: WO2009/084206 WO 20090709
- 主分类号: H01L27/115
- IPC分类号: H01L27/115 ; H01L21/8247 ; H01L29/792 ; H01L29/788
摘要:
A laminated body is formed by alternately laminating a plurality of dielectric films and electrode films on a silicon substrate. Next, a through hole extending in the lamination direction is formed in the laminated body. Next, a selective nitridation process is performed to selectively form a charge layer made of silicon nitride in a region of an inner surface of the through hole corresponding to the electrode film. Next, a high-pressure oxidation process is performed to form a block layer made of silicon oxide between the charge layer and the electrode film. Next, a tunnel layer made of silicon oxide is formed on an inner side surface of the through hole. Thus, a flash memory can be manufactured in which the charge layer is split for each electrode film.
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