发明授权
- 专利标题： Semiconductor chip and semiconductor package including the same
- 专利标题（中）： 半导体芯片和半导体封装包括相同
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申请号： US12835927申请日： 2010-07-14
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公开(公告)号： US08198719B2公开(公告)日： 2012-06-12
- 发明人: Seong Cheol Kim
- 申请人： Seong Cheol Kim
- 申请人地址： KR Gyeonggi-do
- 专利权人： Hynix Semiconductor Inc.
- 当前专利权人： Hynix Semiconductor Inc.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Ladas & Parry LLP
- 优先权： KR10-2009-0112621 20091120
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L23/34 ; H01L23/48 ; H01L23/52
摘要：
A semiconductor chip includes a semiconductor chip body, a through-silicon via and a silicon pattern. The semiconductor chip body has a first surface and a second surface facing away from the first surface. The through-silicon via is formed to pass through the semiconductor chip body and has a metal layer and an insulation layer which protrude from the second surface. The silicon pattern is formed on a sidewall of the protruding through-silicon via.
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