发明授权
- 专利标题： Semiconductor package structure and encapsulating module for molding the same
- 专利标题（中）： 半导体封装结构和封装模块用于成型
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申请号： US12579049申请日： 2009-10-14
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公开(公告)号： US08198740B2公开(公告)日： 2012-06-12
- 发明人: Cheng-Chang Shen , Chen-Tsung Chang , Chih-Yuan Lin
- 申请人： Cheng-Chang Shen , Chen-Tsung Chang , Chih-Yuan Lin
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： Muncy, Geissler, Olds & Lowe, PLLC
- 优先权： TW98111891A 20090409
- 主分类号： H01L23/31
- IPC分类号： H01L23/31
摘要：
A semiconductor package structure and encapsulating module for molding the same and an encapsulating mold for molding the same are provided. The encapsulating mold is used for packaging a substrate having a chip so as to mold the substrate having the chip as a package structure. The encapsulating mold has a pressing surface, a smooth surface and a cavity. The smooth surface having a curvature radius is connected with the pressing surface and disposed at a mouth of the cavity. When the encapsulating mold and an encapsulating lower mold are jointed to hold the substrate, the pressing surface contacts and presses the substrate.
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