Invention Grant
- Patent Title: Printed circuit board, backlight unit having the printed circuit board, and liquid crystal display device having the printed circuit board
- Patent Title (中): 印刷电路板,具有印刷电路板的背光单元和具有印刷电路板的液晶显示装置
-
Application No.: US12343183Application Date: 2008-12-23
-
Publication No.: US08199306B2Publication Date: 2012-06-12
- Inventor: Gwan-Hyoung Lee , Young-Bee Chu , Sang-Hee Lee , Jeong-Seok Oh , Young-Soo Kim , Wal-Hee Kim
- Applicant: Gwan-Hyoung Lee , Young-Bee Chu , Sang-Hee Lee , Jeong-Seok Oh , Young-Soo Kim , Wal-Hee Kim
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2008-0008931 20080129
- Main IPC: G02F1/1345
- IPC: G02F1/1345

Abstract:
A printed circuit board (PCB) includes a base substrate, an electrical wiring, a dummy pad and a thermally conductive adhesion member. The base substrate includes a light-emitting diode (LED) mounted on a first surface of the base substrate. The electrical wiring is electrically connected to the LED. The dummy pad is formed on the first surface to be connected to the electrical wiring. The thermally conductive adhesion member is attached to a second surface of the base substrate. Therefore, superior heat radiation may be obtained, thereby reducing or preventing damage to the LED and the LCD device using the LED by radiating the heat from the LED used as a light source.
Public/Granted literature
Information query
IPC分类: