Invention Grant
- Patent Title: Cover mechanism and electronic device using same
- Patent Title (中): 封盖机构和电子设备使用相同
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Application No.: US12568796Application Date: 2009-09-29
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Publication No.: US08199464B2Publication Date: 2012-06-12
- Inventor: Zhou-Quan Zuo , Hong Wu
- Applicant: Zhou-Quan Zuo , Hong Wu
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN200910303051 20090608
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H01R13/44 ; H01H9/04
Abstract:
A cover mechanism is for an electronic device, and the cover mechanism includes a base member and a cover member. The base member defines a hole and a receiving groove. The cover member is received in the receiving groove. The cover member includes a connecting portion to allow the cover member to be elastically bent to cover the hole.
Public/Granted literature
- US20100309613A1 COVER MECHANISM AND ELECTRONIC DEVICE USING SAME Public/Granted day:2010-12-09
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