Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12497709Application Date: 2009-07-06
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Publication No.: US08199522B2Publication Date: 2012-06-12
- Inventor: Shou-Kuo Hsu , Chun-Jen Chen
- Applicant: Shou-Kuo Hsu , Chun-Jen Chen
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910303397 20090618
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14

Abstract:
A printed circuit board includes a first signal layer, a first reference layer, a second reference layer, and a second signal layer. An integrated circuit mounted on the first signal layer includes a power supply terminal connected to a first power supply via. The second signal layer includes a filter and a power supply wire. The filter includes a power terminal connected to the first power supply via, and a ground terminal connected to the second reference layer. The first power supply via is connected to the first reference layer through the power supply wire and a second power supply via. A void defined in the second reference layer is at least partially vertically overlapping with the power supply wire, and enables the first reference layer to function as a reference plane for the power supply wire, to increase impedance of the power supply wire.
Public/Granted literature
- US20100321910A1 PRINTED CIRCUIT BOARD Public/Granted day:2010-12-23
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