Invention Grant
- Patent Title: Implementation of a communication link in powered device for layer 2 support
- Patent Title (中): 在第2层支持的动力设备中实现通信链路
-
Application No.: US11581355Application Date: 2006-10-17
-
Publication No.: US08199906B2Publication Date: 2012-06-12
- Inventor: Asif Hussain , Manisha Pandya
- Applicant: Asif Hussain , Manisha Pandya
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agent Duane S. Kobayashi
- Main IPC: H04M9/00
- IPC: H04M9/00
Abstract:
A system and method for enabling communication between power source equipment and a powered device chip. In one embodiment, communication between the power source equipment and the powered device chip is enabled through a communication link established between the powered device chip and a host device on the powered device.
Public/Granted literature
- US20080089512A1 Implementation of a communication link in powered device for layer 2 support Public/Granted day:2008-04-17
Information query
