发明授权
- 专利标题: Microphone package
- 专利标题(中): 麦克风包
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申请号: US12321513申请日: 2009-01-21
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公开(公告)号: US08199939B2公开(公告)日: 2012-06-12
- 发明人: Mikko Veli Aimo Suvanto , Tapio Liusvaara
- 申请人: Mikko Veli Aimo Suvanto , Tapio Liusvaara
- 申请人地址: FI Espoo
- 专利权人: Nokia Corporation
- 当前专利权人: Nokia Corporation
- 当前专利权人地址: FI Espoo
- 代理机构: Harrington & Smith
- 主分类号: H04R25/00
- IPC分类号: H04R25/00
摘要:
In one exemplary embodiment, an apparatus includes: a first substrate having an aperture adapted to receive an acoustic signal; a microphone comprising a plate connected to the first substrate and a movable member connected to the first substrate, where the microphone is adapted to transduce the received acoustic signal into an electrical signal; a second substrate connected to the first substrate; at least one wall connected to the first substrate and the second substrate such that the at least one wall, the first substrate, the second substrate and the microphone define an interior cavity; and an electrical component on the second substrate and electrically coupled to the microphone, where the electrical component is configured to generate an output based on the electrical signal.
公开/授权文献
- US20100183174A1 Microphone package 公开/授权日:2010-07-22
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