发明授权
- 专利标题: Process of forming an electronic device including a trench and a conductive structure therein
- 专利标题(中): 在其中形成包括沟槽和导电结构的电子器件的工艺
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申请号: US13213757申请日: 2011-08-19
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公开(公告)号: US08202775B2公开(公告)日: 2012-06-19
- 发明人: Gary H. Loechelt
- 申请人: Gary H. Loechelt
- 申请人地址: US AZ Phoenix
- 专利权人: Semiconductor Components Industries, LLC
- 当前专利权人: Semiconductor Components Industries, LLC
- 当前专利权人地址: US AZ Phoenix
- 代理商 George R. Meyer
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
A process of forming an electronic device can include providing a workpiece comprising a substrate, including an underlying doped region, and a semiconductor portion overlying the underlying doped region, wherein the semiconductor portion has a primary surface spaced apart from the underlying doped region. The process can further include forming a vertically-oriented conductive region extending from the primary surface towards the underlying doped region, forming a horizontally-oriented doped region adjacent to the primary surface, and forming a conductive electrode over, spaced-apart from, and electrically insulated from the vertically-oriented doped region. The process can still further include forming a gate electrode after forming the conductive electrode. The electronic device can include a transistor that includes the underlying doped region, the vertically-oriented conductive region, the horizontally-oriented doped region, and the gate electrode.
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