发明授权
US08202775B2 Process of forming an electronic device including a trench and a conductive structure therein 有权
在其中形成包括沟槽和导电结构的电子器件的工艺

Process of forming an electronic device including a trench and a conductive structure therein
摘要:
A process of forming an electronic device can include providing a workpiece comprising a substrate, including an underlying doped region, and a semiconductor portion overlying the underlying doped region, wherein the semiconductor portion has a primary surface spaced apart from the underlying doped region. The process can further include forming a vertically-oriented conductive region extending from the primary surface towards the underlying doped region, forming a horizontally-oriented doped region adjacent to the primary surface, and forming a conductive electrode over, spaced-apart from, and electrically insulated from the vertically-oriented doped region. The process can still further include forming a gate electrode after forming the conductive electrode. The electronic device can include a transistor that includes the underlying doped region, the vertically-oriented conductive region, the horizontally-oriented doped region, and the gate electrode.
信息查询
0/0