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US08202785B2 Surface treatment for molecular bonding 失效
分子键合的表面处理

Surface treatment for molecular bonding
摘要:
A method of bonding a first substrate to a second substrate by molecular bonding by forming an insulating layer on the bonding face of the first substrate, chemical-mechanical polishing of the insulating layer, activating a bonding surface of the second substrate by plasma treatment, etching an exposed surface of the insulating layer, and bonding together the two substrates together by molecular bonding wherein the etching is conducted after the chemical-mechanical polishing and before the bonding.
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