发明授权
- 专利标题： Physical failure analysis guiding methods
- 专利标题（中）： 物理故障分析指导方法
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申请号： US12818003申请日： 2010-06-17
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公开(公告)号： US08205173B2公开(公告)日： 2012-06-19
- 发明人: Sunny Wu , Yen-Di Tsen , Monghsung Chuang , Fu-Min Huang , Jo Fei Wang , Jong-I Mou
- 申请人： Sunny Wu , Yen-Di Tsen , Monghsung Chuang , Fu-Min Huang , Jo Fei Wang , Jong-I Mou
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： G06F17/50
- IPC分类号： G06F17/50 ; G06F19/00 ; G06F11/00 ; G01R31/00
摘要：
A method includes providing a plurality of failure dies, and performing a chip probing on the plurality of failure dies to generate a data log comprising electrical characteristics of the plurality of failure dies. An automatic net tracing is performed to trace failure candidate nodes in the failure dies. A failure layer analysis is performed on results obtained from the automatic net tracing. Physical failure analysis (PFA) samples are selected from the plurality of failure dies using results obtained in the step of performing the failure layer analysis.
公开/授权文献
- US20110314336A1 Physical Failure Analysis Guiding Methods 公开/授权日：2011-12-22
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