Invention Grant
- Patent Title: Hinge assembly and eletronic device using the same
- Patent Title (中): 铰链组装和电子装置使用相同
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Application No.: US12488723Application Date: 2009-06-22
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Publication No.: US08205301B2Publication Date: 2012-06-26
- Inventor: Jin-Xin Wang , Lian-Cheng Huang , Jian Li , Guo-Jin Cai
- Applicant: Jin-Xin Wang , Lian-Cheng Huang , Jian Li , Guo-Jin Cai
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910301970 20090429
- Main IPC: E05D11/10
- IPC: E05D11/10

Abstract:
A hinge assembly includes a first bracket, a second bracket, a damping member, and a torsion resilient member. The first bracket defines a damping protrusion. The second bracket is rotatable relative to the first bracket. The damping member defines a depression. The damping protrusion is configured to engage with the depression. The torsion resilient member urges the first bracket to rotate relative to the second bracket and the damping member. The engagement of damping protrusion and the depression prevents the first bracket from rotating when the first bracket rotates through a predetermined angle. When the first bracket rotates through the predetermined angle relative to the second bracket and the damping member, the first bracket together with the damping member are rotatable relative to the second bracket to any desired angle.
Public/Granted literature
- US20100275412A1 HINGE ASSEMBLY AND ELETRONIC DEVICE USING THE SAME Public/Granted day:2010-11-04
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