发明授权
- 专利标题: Non-metallic, integrated sensor-interconnect device, manufacturing process, and related applications
- 专利标题(中): 非金属,集成传感器互连器件,制造工艺及相关应用
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申请号: US12402717申请日: 2009-03-12
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公开(公告)号: US08207446B2公开(公告)日: 2012-06-26
- 发明人: Joseph A. Swift , Stanley J. Wallace , Roger Lee Bullock
- 申请人: Joseph A. Swift , Stanley J. Wallace , Roger Lee Bullock
- 申请人地址: US CT Norwalk
- 专利权人: Xerox Corporation
- 当前专利权人: Xerox Corporation
- 当前专利权人地址: US CT Norwalk
- 代理机构: MH2 Technology Law Group LLP
- 主分类号: H01B3/00
- IPC分类号: H01B3/00
摘要:
Exemplary embodiments provide materials, devices and arrays of integrated sensor assembly, as well as methods for forming and using such devices and arrays in sensing systems. In one embodiment, the integrated sensor assembly can include an interconnecting member and at least one sensor member connected with the interconnecting member at any location thereof. Each of the sensor member and the interconnecting member can include a core element and a polymer. The core element for the sensor member and the core element for the interconnecting member can be electrically interconnected. Various embodiments can also include a connector member connected to the interconnecting member for transmitting sensing signals from or to the sensor member.
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