Invention Grant
US08207450B2 Printed circuit board comprising metal bumps integrated with connection pads
有权
印刷电路板包括与连接焊盘集成的金属凸块
- Patent Title: Printed circuit board comprising metal bumps integrated with connection pads
- Patent Title (中): 印刷电路板包括与连接焊盘集成的金属凸块
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Application No.: US12382360Application Date: 2009-03-13
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Publication No.: US08207450B2Publication Date: 2012-06-26
- Inventor: Jin Yong An , Jae Joon Lee
- Applicant: Jin Yong An , Jae Joon Lee
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0124154 20081208
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
Disclosed herein is a printed circuit board, including: an upper circuit layer including connection pads made of a conductive metal and buried in an insulation layer; and metal bumps, each having a constant diameter, which are integrated with the connection pads and protrude over the insulation layer.
Public/Granted literature
- US20100139964A1 Printed circuit board comprising metal bump and method of manufacturing the same Public/Granted day:2010-06-10
Information query
