发明授权
- 专利标题： Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
- 专利标题（中）： 半导体发光元件，发光模块，照明装置，显示元件及半导体发光元件的制造方法
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申请号： US12615600申请日： 2009-11-10
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公开(公告)号： US08207548B2公开(公告)日： 2012-06-26
- 发明人: Hideo Nagai
- 申请人： Hideo Nagai
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 优先权： JP2003-305402 20030828; JP2003-340020 20030930; JP2004-026851 20040203
- 主分类号： H01L29/201
- IPC分类号： H01L29/201 ; H01L33/00 ; H01L29/205 ; H01L29/207 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
An LED array chip (2), which is one type of a semiconductor light emitting device, includes an array of LEDs (6), a base substrate (4) supporting the array of the LEDs (6), and a phosphor film (48). The array of LEDs (6) is formed by dividing a multilayer epitaxial structure including a light emitting layer into a plurality of portions. The phosphor film (48) covers an upper surface of the array of the LEDs (6) and a part of every side surface of the array of LEDs (6). Here, the part extends from the upper surface to the light emitting layer.
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