Invention Grant
- Patent Title: Electromagnetic relay
- Patent Title (中): 电磁继电器
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Application No.: US12543547Application Date: 2009-08-19
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Publication No.: US08207803B2Publication Date: 2012-06-26
- Inventor: Daiei Iwamoto , Takashi Yuba , Satoshi Takano , Hirofumi Saso
- Applicant: Daiei Iwamoto , Takashi Yuba , Satoshi Takano , Hirofumi Saso
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2008-236192 20080916
- Main IPC: H01H51/22
- IPC: H01H51/22

Abstract:
An electromagnetic relay includes a coil, an armature that is electromagnetically attracted by the coil when current flows through the coil, two fixed contacts, a movable spring disposed to be movable to the fixed contacts, a conductive plate that is connected to the movable spring and including two movable contacts. The movable contacts are brought in contact with the fixed contacts respectively via the movable spring by the armature attracted by the coil. When the fixed contacts and the movable contacts are in contact, the fixed contacts are electrically connected to each other via the conductive plate. The movable spring is made of an insulating material.
Public/Granted literature
- US20100066468A1 ELECTROMAGNETIC RELAY Public/Granted day:2010-03-18
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