A multilayer electronic component is provided which includes layers composed of different materials and bonded together and which is capable of suppressing the occurrence of delamination at a bonded portion between the layers composed of different materials. A magnetic first layer is composed of a material with relatively high magnetic permeability. A second magnetic layer is composed of a material with relatively low magnetic permeability. Boundary magnetic layers are provided between the two magnetic layers and include a partial magnetic layer composed of the same material as the first magnetic layer and a partial magnetic layer composed of the same material as the second magnetic layer. The partial magnetic layers are provided to be adjacent to each other in the boundary magnetic layers.