Invention Grant
- Patent Title: Window base material, card with embedded module, and manufacturing method of card with embedded module
- Patent Title (中): 窗口基材,嵌入式模块卡,嵌入式模块卡制造方法
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Application No.: US12447910Application Date: 2007-11-07
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Publication No.: US08208262B2Publication Date: 2012-06-26
- Inventor: Takahiro Sakurai , Yuichi Ito
- Applicant: Takahiro Sakurai , Yuichi Ito
- Applicant Address: JP Tokyo
- Assignee: Toppan Forms Co., Ltd.
- Current Assignee: Toppan Forms Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-301520 20061107; JP2006-301522 20061107
- International Application: PCT/JP2007/071660 WO 20071107
- International Announcement: WO2008/056714 WO 20080515
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
The window base material of the present invention is provided with an intermediate layer having a window section composed of transparent resin and a colored section composed of colored resin surrounding the window section, and a transparent first base material and second base material which sandwich the intermediate layer. The card with embedded module of the present invention is provided with a module having a display element, an adhesive layer covering the module, and a paired third base material and fourth base material which sandwich the module with interposition of the adhesive layer, wherein the third base material is composed of the window base material, and the display section of the display element is disposed so as to face the window section of the window base material. According to the present invention, a card with embedded module is offered, which incorporates a display element as an electronic component, which renders the display section of this display element visible from the outside, and which is easy to manufacture.
Public/Granted literature
- US20100085718A1 WINDOW BASE MATERIAL, CARD WITH EMBEDDED MODULE, AND MANUFACTURING METHOD OF CARD WITH EMBEDDED MODULE Public/Granted day:2010-04-08
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