发明授权
US08208673B2 Miniaturized acoustic boom structure for reducing microphone wind noise and ESD susceptibility
有权
用于降低麦克风风噪声和ESD敏感性的小型化声臂结构
- 专利标题: Miniaturized acoustic boom structure for reducing microphone wind noise and ESD susceptibility
- 专利标题(中): 用于降低麦克风风噪声和ESD敏感性的小型化声臂结构
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申请号: US12114583申请日: 2008-05-02
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公开(公告)号: US08208673B2公开(公告)日: 2012-06-26
- 发明人: John Steven Graham , Osman Kemal Isvan
- 申请人: John Steven Graham , Osman Kemal Isvan
- 申请人地址: US CA Santa Cruz
- 专利权人: Plantronics, Inc
- 当前专利权人: Plantronics, Inc
- 当前专利权人地址: US CA Santa Cruz
- 代理机构: Chuang Intellectual Property Law
- 主分类号: H04R25/00
- IPC分类号: H04R25/00 ; H04R1/02 ; H04M9/00 ; H04M1/00 ; F01N13/00
摘要:
A miniaturized acoustic boom structure includes a microphone boom housing having a wind screen and a microphone pod configured to hold a microphone. The microphone pod has an outer surface secured to an inner surface of the microphone boom housing, an interior having one or more surfaces configured to form an acoustic seal around at least a portion of the periphery of the microphone, and first and second pod port openings. The first and second pod port openings provide sound wave access to opposing sides of a diaphragm of the microphone, and are shaped and spaced away from the first and second microphone ports of the microphone so that an acoustic path length between the first and second pod port openings is greater than an acoustic path length between the first and second microphone ports.
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