发明授权
- 专利标题： Copper base rolled alloy and manufacturing method therefor
- 专利标题（中）： 铜基轧制合金及其制造方法
-
申请号： US12342613申请日： 2008-12-23
-
公开(公告)号： US08211249B2公开(公告)日： 2012-07-03
- 发明人: Tetsuo Sakai , Naokuni Muramatsu , Koki Chiba , Naoki Yamagami
- 申请人： Tetsuo Sakai , Naokuni Muramatsu , Koki Chiba , Naoki Yamagami
- 申请人地址： JP Nagoya JP Suita-Shi
- 专利权人： NGK Insulators, Ltd.,Osaka University
- 当前专利权人： NGK Insulators, Ltd.,Osaka University
- 当前专利权人地址： JP Nagoya JP Suita-Shi
- 代理机构： Burr & Brown
- 优先权： JP2006-174419 20060623
- 主分类号： C12Q1/68
- IPC分类号： C12Q1/68 ; C22F1/08
摘要：
A copper base rolled alloy has a copper base alloy composition containing 0.05 percent by mass or more, and 10 percent by mass or less of at least one type of element selected from Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr and Sn, wherein the X-ray diffraction intensity ratio I(111)/I(200) where I(hkl) is the X-ray diffraction intensity from (hkl)plane measured with respect to a rolled surface is 2.0 or more.
公开/授权文献
信息查询
