A method for making a microelectronic device comprising at least one electromechanical component provided with a mobile structure, the method comprising the steps of: forming in at least one fine semiconducting thin layer lying on a supporting layer, at least one bar bound to a block, said bar being intended to form a mobile structure of an electromechanical component, withdrawing a portion of the supporting layer under said bar, forming at least one passivation layer based on dielectric material around said bar, forming an encapsulation layer around the bar and covering said passivation layer, the method further comprising steps of: making metal contact and/or interconnection areas, and then suppressing the encapsulation layer around said bar.