发明授权
- 专利标题: Electromagnetic interference noise reduction board using electromagnetic bandgap structure
- 专利标题(中): 电磁干扰降噪板采用电磁带隙结构
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申请号: US12654368申请日: 2009-12-17
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公开(公告)号: US08212150B2公开(公告)日: 2012-07-03
- 发明人: Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
- 申请人: Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2009-0089799 20090922
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.
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