发明授权
- 专利标题： Solid-state imaging element
- 专利标题（中）： 固态成像元件
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申请号： US13052903申请日： 2011-03-21
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公开(公告)号： US08212214B2公开(公告)日： 2012-07-03
- 发明人: Hiroto Honda , Hideyuki Funaki
- 申请人： Hiroto Honda , Hideyuki Funaki
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2008-246300 20080925
- 主分类号： G01J5/00
- IPC分类号： G01J5/00 ; G01J5/20
摘要：
It is possible to quickly and readily determine the location of an object. A solid-state imaging element according to an embodiment includes: at least two infrared detectors formed on a semiconductor substrate; an electric interconnect configured to connect the at least two infrared detectors in series; and a comparator unit configured to compare an intermediate voltage of the electric interconnect connecting the infrared detectors in series, with a predetermined reference voltage.
公开/授权文献
- US20110226953A1 SOLID-STATE IMAGING ELEMENT 公开/授权日：2011-09-22
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