发明授权
US08212259B2 III-V nitride homoepitaxial material of improved quality formed on free-standing (Al,In,Ga)N substrates
有权
在独立(Al,In,Ga)N基板上形成改进质量的III-V族氮化物同质外延材料
- 专利标题: III-V nitride homoepitaxial material of improved quality formed on free-standing (Al,In,Ga)N substrates
- 专利标题(中): 在独立(Al,In,Ga)N基板上形成改进质量的III-V族氮化物同质外延材料
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申请号: US10313561申请日: 2002-12-06
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公开(公告)号: US08212259B2公开(公告)日: 2012-07-03
- 发明人: Jeffrey S. Flynn , George R. Brandes , Robert P. Vaudo , David M. Keogh , Xueping Xu , Barbara E. Landini
- 申请人: Jeffrey S. Flynn , George R. Brandes , Robert P. Vaudo , David M. Keogh , Xueping Xu , Barbara E. Landini
- 申请人地址: US NC Durham
- 专利权人: Cree, Inc.
- 当前专利权人: Cree, Inc.
- 当前专利权人地址: US NC Durham
- 代理机构: Jenkins, Wilson, Taylor & Hunt, P.A.
- 代理商 Vincent K. Gustafson
- 主分类号: H01L29/20
- IPC分类号: H01L29/20 ; H01L21/18
摘要:
A III-V nitride homoepitaxial microelectronic device structure comprising a III-V nitride homoepitaxial epi layer of improved epitaxial quality deposited on a III-V nitride material substrate, e.g., of freestanding character. Various processing techniques are described, including a method of forming a III-V nitride homoepitaxial layer on a corresponding III-V nitride material substrate, by depositing the III-V nitride homoepitaxial layer by a VPE process using Group III source material and nitrogen source material under process conditions including V/III ratio in a range of from about 1 to about 105, nitrogen source material partial pressure in a range of from about 1 to about 103 torr, growth temperature in a range of from about 500 to about 1250 degrees Celsius, and growth rate in a range of from about 0.1 to about 102 microns per hour. The III-V nitride homoepitaxial microelectronic device structures are usefully employed in device applications such as UV LEDs, high electron mobility transistors, and the like.
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