发明授权
US08213705B2 Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer
有权
用于精确识别形成在晶片上的阵列区域的护理区域的边缘的方法以及在形成在晶片上的阵列区域中检测到的合并缺陷的方法
- 专利标题： Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer
- 专利标题（中）： 用于精确识别形成在晶片上的阵列区域的护理区域的边缘的方法以及在形成在晶片上的阵列区域中检测到的合并缺陷的方法
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申请号： US13032577申请日： 2011-02-22
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公开(公告)号： US08213705B2公开(公告)日： 2012-07-03
- 发明人: Chien-Huei (Adam) Chen , Xiaoming Wang , Eugene Shifrin , Tsung-Pao Fang
- 申请人： Chien-Huei (Adam) Chen , Xiaoming Wang , Eugene Shifrin , Tsung-Pao Fang
- 申请人地址： US CA Milpitas
- 专利权人： KLA-Tencor Technologies Corp.
- 当前专利权人： KLA-Tencor Technologies Corp.
- 当前专利权人地址： US CA Milpitas
- 代理商 Anne Marie Mewherter
- 主分类号： G06K9/62
- IPC分类号： G06K9/62
摘要：
Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.
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